Coupling Effects during Thermo-Fluidic Analysis of Flip-Chip Devices with Peripheral Components – CFD Simulation and Experimental Study

  • The amount and concentration of electronic components and passive objects on board level increases rapidly. Furthermore, the complexity between conductive heat spreading and the use of forced thermo-fluidic coupling effects with application near behavior will become a challenge to prevent thermal bottlenecks during layout processing. For printed circuit board (PCB) designer, it would be helpful to consider the estimation of real thermal behavior without time consuming CFD analysis. A thermo-fluidic correction factor according to thermal resistance which should be a function of air velocity, power loss, and distance between active or passive components as well as the dimensions of electronic parts could help thermal engineers during layout process. Backwards, results were published for several benchmark studies with the investigation on convective and conductive interaction on commercially available microelectronic packages. Today, Flip-Chip (FC) assembly process of bare dies become being more up-to-date. A new investigation startedThe amount and concentration of electronic components and passive objects on board level increases rapidly. Furthermore, the complexity between conductive heat spreading and the use of forced thermo-fluidic coupling effects with application near behavior will become a challenge to prevent thermal bottlenecks during layout processing. For printed circuit board (PCB) designer, it would be helpful to consider the estimation of real thermal behavior without time consuming CFD analysis. A thermo-fluidic correction factor according to thermal resistance which should be a function of air velocity, power loss, and distance between active or passive components as well as the dimensions of electronic parts could help thermal engineers during layout process. Backwards, results were published for several benchmark studies with the investigation on convective and conductive interaction on commercially available microelectronic packages. Today, Flip-Chip (FC) assembly process of bare dies become being more up-to-date. A new investigation started to figure out interactions between natural and forced thermo-fluidic behavior of bare FC dies and near different components, mounted on a test PCB. To generate first rough estimations of the real fluid situation behavior current CFD modelling and simulation software are used. A suitable agreement between CFD simulation results and experimental analysis will be presented.show moreshow less

Export metadata

Additional Services

Search Google Scholar
Metadaten
Author: Torsten Nowak, Ralph SchachtGND
Document Type:Image (poster)
Language:English
Year of publication:2016
Tag:CFD, Flip-Chip, thermo-fluidic Experiment
Comment:
14th Multiphase Flow Conference and Short Course- Multiphase Flows - Simulation, Experiment and Application, November 2016, Dresden
Faculty/Chair:Fakultät 3 Maschinenbau, Elektro- und Energiesysteme / FG Elektronische Schaltungstechnik
Einverstanden ✔
Diese Webseite verwendet technisch erforderliche Session-Cookies. Durch die weitere Nutzung der Webseite stimmen Sie diesem zu. Unsere Datenschutzerklärung finden Sie hier.