Sacrificial Self-Assembled Monolayers for the Passivation of GaAs(100) Surfaces and Interfaces

  • The use of sacrificial self-assembled monolayers (SAMs) to prepare clean n-type GaAs (100) surfaces without band bending in vacuo is demonstrated. GaAs surface passivation using octadecanethiol SAMs after HCl cleaning is shown to lead to an enhancement of the room-temperature photoluminescence intensity. Synchrotron-radiation photoelectron spectroscopy (SRPES) finds that the interfacial oxide between GaAs and the SAM remains below the detection limit. Evidence for both Ga–S and As–S bonds at the GaAs–thiolate interface is found. The limited thermal stability of the SAM allows the desorption of the alkyl chains by in situ thermal annealing at temperatures above 180 °C, leaving S bonded to Ga behind. The resulting surface contains only a very small amount of O (0.05 ML coverage) and C (about 3% of the SAM remaining) and shows no band bending with the surface Fermi level close to the conduction band. Atomic layer deposition of Al₂O₃ on this surface occurs via the formation of Al–S bonds without introducing any additional band bending.The use of sacrificial self-assembled monolayers (SAMs) to prepare clean n-type GaAs (100) surfaces without band bending in vacuo is demonstrated. GaAs surface passivation using octadecanethiol SAMs after HCl cleaning is shown to lead to an enhancement of the room-temperature photoluminescence intensity. Synchrotron-radiation photoelectron spectroscopy (SRPES) finds that the interfacial oxide between GaAs and the SAM remains below the detection limit. Evidence for both Ga–S and As–S bonds at the GaAs–thiolate interface is found. The limited thermal stability of the SAM allows the desorption of the alkyl chains by in situ thermal annealing at temperatures above 180 °C, leaving S bonded to Ga behind. The resulting surface contains only a very small amount of O (0.05 ML coverage) and C (about 3% of the SAM remaining) and shows no band bending with the surface Fermi level close to the conduction band. Atomic layer deposition of Al₂O₃ on this surface occurs via the formation of Al–S bonds without introducing any additional band bending. This indicates that the surface preparation of n-type GaAs (100) using sacrificial octadecanethiol SAMs followed by in situ thermal removal provides a route toward GaAs/oxide interfaces without interfacial oxides and without band bending.show moreshow less

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Author: Daniel Cuypers, Claudia Fleischmann, Dennis H. von DorpORCiD, Simone Brizzi, Massimo TallaridaORCiD, Matthias Müller, Philipp Hönicke, Arne Billen, Ravi Chintala, Thierry Conard, Dieter SchmeißerORCiD, Wilfried Vandervorst, Sven van Elshocht, Silvia Armini, Stefan De Gendt, Christoph AdelmannORCiD
DOI:https://doi.org/10.1021/acs.chemmater.6b01732
ISSN:0897-4756
ISSN:1520-5002
Title of the source (English):Chemistry of Materials
Document Type:Scientific journal article peer-reviewed
Language:English
Year of publication:2016
Tag:Al₂O₃; GaAs; Synchrotron-radiation photoelectron spectroscopy (SRPES); atomic layer deposition (ALD); interface engineering; passivation; self assembled monolayers (SAM)
Volume/Year:28
Issue number:16
First Page:5689
Last Page:5701
Faculty/Chair:Fakultät 1 MINT - Mathematik, Informatik, Physik, Elektro- und Informationstechnik / FG Angewandte Physik und Halbleiterspektroskopie
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