MetadatenAuthor: | Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub |
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DOI: | https://doi.org/10.1115/IPACK2015-48733 |
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ISBN: | 978-0-7918-5690-1 |
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Title of the source (English): | Proceedings, ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels |
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Publisher: | ASME |
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Place of publication: | New York, NY |
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Document Type: | Conference Proceeding |
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Language: | English |
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Year of publication: | 2015 |
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Number of pages: | 6 |
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Faculty/Chair: | Fakultät 1 MINT - Mathematik, Informatik, Physik, Elektro- und Informationstechnik / FG Elektronische Systeme und Sensorik |
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